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| IA NT Features Applications Lead free as standard RoHS compliant* Leadless Low stored charge Cellular phones PDAs Desktop PCs and notebooks Digital cameras MP3 players CD0805-xxxx products are currently available, although not recommended for new designs. Use CD1005-xxxx products as an alternative. *R oH S CO M PL General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers small-signal high-speed Schottky Barrier Diodes for switching and rectification applications, in compact chip package 0805 size format, which offer PCB real estate savings and are considerably smaller than competitive parts. The Schottky Barrier Diodes offer a forward current of 30 mA, 100 mA or 200 mA, a reverse voltage of 30 V, 40 V or 45V and also have a low forward voltage option. The diodes are leadfree with Cu/Ni/Au plated terminations and are compatible with lead-free manufacturing processes, conforming to many industry and government regulations on lead-free components. Bourns(R) Chip Diodes conform to JEDEC standards, easy to handle on standard pick and place equipment and their flat configuration makes roll away much more difficult. Electrical Characteristics (@ TA = 25 C Unless Otherwise Noted) Parameter Symbol CD0805B00340 CD0805B0130 CD0805B0130L CD0805B0145 CD0805B0230 CD0805B0245 Unit Forward Voltage (Max.) Capacitance Between Terminals (Max.) (f = 1 MHz) Reverse Current (Max.) Absolute Ratings (@ TA = 25 C Unless Otherwise Noted) 6 VF CT IR Symbol Schottky Barrier Chip Diode Series - 0805 0.37 (If = 1 mA) 2 (Vr = 1 V) 1 (Vr = 40 V) 1.00 (If = 0.1 A) 6 (Vr = 10 V) 2 (Vr = 25 V) 0.44 (If = 0.1 A) 12 (Vr = 10 V) 30 (Vr = 30 V) 0.55 (If = 0.1 A) 6 (Vr = 10 V) 30 (Vr = 45 V) 0.50 (If = 0.2 A) 12 (Vr = 10 V) 30 (Vr = 30 V) 0.55 (If = 0.2 A) 12 (Vr = 10 V) 30 (Vr = 45 V) V pF A Parameter Repetitive Peak Reverse Voltage Reverse Voltage Average Forward Current Forward Current, Surge Peak Power Dissipation Storage Temperature Junction Temperature CD0805B00340 CD0805B0130 CD0805B0130L CD0805B0145 CD0805B0230 CD0805B0245 Unit VRRM VR Io Isurge PD TSTG TJ 45 40 30 500* 200 30 30 100 1000* 300 35 30 100 1000* 300 50 45 100 1000* 300 35 30 200 3000* 300 50 45 200 3000* 250 V V mA mA mW C C -40 to +125 -40 to +125 How To Order * Condition: 8.3 ms single half sine-wave superimposed on rate load (JEDEC method). CD 0805 - B 01 30 L Common Code Chip Diode Package * 0805 Model B = Schottky Barrier Series Average Forward Current (Io) Code 003 = 30 mA 01 = 100 mA 02 = 200 mA (Code x 1000 mA = Average Forward Current) Reverse Voltage (VR) Code 30 = 30 V 40 = 40 V 45 = 45 V Forward Voltage Suffix L = Low Forward Voltage Vf (CD0805-B0130L) *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Schottky Barrier Chip Diode Series - 0805 Product Dimensions A C Recommended Pad Layout A D B B C E Dimension A (Max.) B (Min.) Dimension A B C D E 0805 2.00 - 2.20 (0.079 - 0.087) 1.20 - 1.40 (0.047 - 0.055) 0.40 Typ. (0.016) 0.20 R Typ. (0.008) 0.90 - 1.10 (0.035 - 0.043) MM (INCHES) C (Min.) 0805 2.10 (0.082) 1.20 (0.047) 1.20 (0.047) MM (INCHES) DIMENSIONS: Physical Specifications Case..........................................................0805(2012) Molded plastic Terminals ......................Solder plated, solderable per MIL-STD-750, Method 2026 Polarity ....................................................Indicated by cathode band Mounting Position ........................................................................Any Weight ............................................0.000159 ounces / 0.0045 grams Typical Part Marking CD0805-B00340 ..............................................................................B2 CD0805-B0130 ................................................................................B1 CD0805-B0130L ..............................................................................B3 CD0805-B0145 ................................................................................B4 CD0805-B0230 ................................................................................B5 CD0805-B0245 ................................................................................B6 DIMENSIONS: Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Schottky Barrier Chip Diode Series - 0805 Rating and Characteristic Curves: CD0805-B00340 Forward Characteristics 10 Reverse Characteristics 1000000 100000 1 Forward Current (mAmps) 10000 Reverse Current (nA) 125 C 85 C 1000 0.1 125 C 85 C 25 C -25 C 100 25 C 0.01 0.0 0.1 0.2 0.3 0.4 0.5 10 0 10 20 Reverse Voltage (Volts) 30 40 Forward Voltage (Volts) Derating Curve 120 Mounting on glass epoxy PCBs Capacitance Between Terminals 16 F = 1 MHz Ta = 25 C 14 Capacitance Between Terminals (pF) 100 12 80 I0 Current (%) 10 60 8 6 4 40 20 2 0 0 0 25 50 75 100 125 150 0 5 10 15 20 25 30 Reverse Voltage (Volts) Ambient Temperature (C) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Schottky Barrier Chip Diode Series - 0805 Rating and Characteristic Curves: CD0805-B0130 Forward Characteristics 1000 Reverse Characteristics 1000000 100000 Forward Current (mAmps) 125 C 100 10000 Reverse Current (nA) 85 C 1000 10 100 25 C 1 0.0 125 C 0.1 85 C 0.2 25 C 0.3 -25 C 0.4 0.5 0.6 10 0 5 10 15 20 25 30 Forward Voltage (Volts) Reverse Voltage (Volts) Derating Curve 120 Mounting on glass epoxy PCBs Capacitance Between Terminals 16 F = 1 MHz Ta = 25 C 14 100 Capacitance Between Terminals (pF) 12 80 I0 Current (%) 10 60 8 6 40 4 20 2 0 0 25 50 75 100 125 150 0 0 5 10 15 20 25 30 Ambient Temperature (C) Reverse Voltage (Volts) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Schottky Barrier Chip Diode Series - 0805 Rating and Characteristic Curves: CD0805-B0130L Forward Characteristics 1000 Reverse Characteristics 10000000 1000000 100 Forward Current (mAmps) 100000 Reverse Current (nA) 125 C 10000 85 C 10 1000 25 C 100 125 C 1 0.00 0.11 85 C 25 C 0.22 Forward Voltage (Volts) -25 C 0.33 0.4 10 0 5 10 15 20 25 30 35 Reverse Voltage (Volts) Derating Curve 120 Mounting on glass epoxy PCBs 100 Capacitance Between Terminals 20.0 18.0 Capacitance Between Terminals (pF) 16.0 14.0 12.0 10.0 8.0 6.0 4.0 F = 1 MHz Ta = Room Temperature 80 I0 Current (%) 60 40 20 2.0 0.0 0 0 25 50 75 100 125 150 0 5 10 15 20 25 30 35 Reverse Voltage (Volts) Ambient Temperature (C) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Schottky Barrier Chip Diode Series - 0805 Rating and Characteristic Curves: CD0805-B0145 Forward Characteristics 1000 Reverse Characteristics 1000000 100000 125 C 100 Reverse Current (nA) Forward Current (mAmps) 10000 85 C 1000 10 100 25 C 125 C 1 0.0 0.1 85 C 0.2 25 C 0.3 -25 C 0.4 0.5 10 0 10 20 30 40 50 Reverse Voltage (Volts) Derating Curve 120 Mounting on glass epoxy PCBs 100 Capacitance Between Terminals 20 18 16 Capacitance Between Terminals (pF) 14 12 10 8 6 4 F = 1 MHz Ta = 25 C 80 I0 Current (%) 60 40 20 2 0 0 5 10 15 20 25 30 35 0 0 25 50 75 100 125 150 Reverse Voltage (Volts) Ambient Temperature (C) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Schottky Barrier Chip Diode Series - 0805 Rating and Characteristic Curves: CD0805-B0230 Forward Characteristics 1000 Reverse Characteristics 10000000 1000000 100 Forward Current (mAmps) Reverse Current (nA) 100000 125 C 85 C 10000 10 1000 25 C 100 125 C 1 0.0 0.1 85 C 0.2 25 C 0.3 -25 C 10 0.4 0.5 0 5 10 15 20 25 30 35 Forward Voltage (Volts) Reverse Voltage (Volts) Derating Curve 120 Mounting on glass epoxy PCBs 100 Capacitance Between Terminals 100.0 90.0 80.0 Capacitance Between Terminals (pF) 70.0 60.0 50.0 40.0 30.0 20.0 F = 1 MHz Ta = 25 C 80 I0 Current (%) 60 40 20 10.0 0.0 0 0 25 50 75 100 125 150 0 5 10 15 20 25 30 35 Reverse Voltage (Volts) Ambient Temperature (C) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Schottky Barrier Chip Diode Series - 0805 Rating and Characteristic Curves: CD0805-B0245 Forward Characteristics 1000 Reverse Characteristics 10000000 1000000 Reverse Current (nA) 125 C 100000 100 Forward Current (mAmps) 10000 85 C 1000 10 25 C 100 125 C 1 0.0 0.1 85 C 0.2 25 C 0.3 -25 C 0.4 0.5 10 0 10 20 30 40 50 Reverse Voltage (Volts) Forward Voltage (Volts) Derating Curve 120 Mounting on glass epoxy PCBs 100 Capacitance Between Terminals 100 90 80 Capacitance Between Terminals (pF) 70 60 50 40 30 20 F = 1 MHz Ta = 25 C 80 I0 Current (%) 60 40 20 10 0 0 25 50 75 100 125 150 0 0 5 10 15 20 25 30 35 Ambient Temperature (C) Reverse Voltage (Volts) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Schottky Barrier Chip Diode Series - 0805 Packaging Information The product will be dispensed in Tape and Reel format (see diagram below). P 0 P 1 E Index Hole 120 F W B D2 D1 D T d P Trailer A Device C Leader W1 Start DIMENSIONS: MM (INCHES) End ....... ....... ....... ....... ....... ....... ....... ....... 10 pitches (min.) 10 pitches (min.) Direction of Feed Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Symbol A B C d D D1 D2 E F P P0 P1 T W W1 -0805 1.55 0.10 (0.061 - 0.004) 2.30 0.10 (0.091 - 0.004) 1.25 0.10 (0.049 - 0.004) 1.55 0.05 (0.061 - 0.002) 178 (7.008) 60.0 MIN. (2.362) 13.0 0.20 (0.512 - 0.008) 1.75 0.10 (0.069 - 0.004)) 3.50 0.05 (0.138 - 0.002) 4.00 0.10 (0.157 - 0.004) 4.00 0.10 (0.157 - 0.004) 2.00 0.05 (0.079 - 0.002) 0.25 0.05 (0.010 - 0.002) 8.00 0.20 (0.315 - 0.008) 13.5 MAX. (0.531) 3,000 Item Carrier Width Carrier Length Carrier Depth Sprocket Hole Reel Outside Diameter Reel Inner Diameter Feed Hole Diameter Sprocket Hole Position Punch Hole Position Punch Hole Pitch Sprocket Hole Pitch Embossment Center Overall Tape Thickness Tape Width Reel Width Quantity per Reel Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. COPYRIGHT(c) 2003, BOURNS, INC. LITHO IN U.S.A. 10/03 e/IPA0303 REV. 01/06 |
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